Feature:
Laser safety windows
High precision and fast soldering
Fast control of heat input(laser on/off)
Easy-to-use super intelligent visualized vision programming for soldering
Dispense Solder Paste/Feed Solder Wire、Laser heating
Non-contact heating、regional heating、low thermal stress
Customized laser spot size, multi-points soldering one time
CCD locate and laser measure distance to ensure soldering accuracy and FPY
Soldering Process:
Application: Optoelectronics, Sensor, Speaker, Vibrator, Appliance, Connector, FPC, Module.
Model | LPS730 |
Dimension | 980*1100*1780mm |
Product Max.Size | 200*300/200*300mm |
Travel Rang(x*y*z*c) | 500*650*80/80mm |
Motion Control Mode | IPC |
Drive Mode | Servo Motor/Ball Screw |
Number of Axis | 6 Axes |
Laser Power Range | 0-300W |
Diameter of Solder Wire | 0.3-2.0mm |
Solder Power Particle size | 5-150μm (Type1-Type6) |
Laser Type | Semiconductor Laser |
Max Power Consumption | AC185-265Vac/1500w |
Minimum Soldering Distance | 0.2mm |
Travel Maximum | 1000mm/s |
Repeat Position Accuracy | ±0.05mm |
Weight(kg) | 700kg |
Work Environment | 0-40°(on-condensing)@10%-90%(Humidity) |