Feature:
Ping-pong Operation
Pattern Recognition
Fiducial Alignment
Automatic height measurement
Automatic Calibration
Fluxless、no pollution、no cleaning
Non-contract soldering, low thermal
Stencil-less fast&high precision solder
Easy-to-use super intelligent visualized, vision programming for soldering
Operation and Soldering Process:
Application: BGA CLCC Rework/Repair/Balling, CCM Camera Module, Connector, TWS, MEMS, Optoelectronics/Mircooptics, eWatch, RJ45.
Model | LAB730 |
Dimension | 980*1100*1780mm |
Product Max.Size | 200*300/200*300mm |
Travel Rang(x*y*z*c) | 500*650*80/80mm |
Motion Control Mode | IPC |
Drive Mode | Servo Motor/Ball Screw |
Number of Axis | 6 Axes |
Laser Power Range | 0-300W |
Diameter of Solder Ball | 0.2-1.8mm |
Laser Type | Fiber Laser |
| Max Power Consumption | 185-265Vac/1500w |
Minimum Soldering Distance | 0.2mm |
| Travel Maximum | 1000mm/s |
Repeat Position Accuracy | ±0.01mm |
Weight(kg) | 700kg |
| Nitrogen Flow Rate | 0.75L/min |
Nitrogen Pressure | 3-12Bar |
sherry@melway.cn
10th Floor, Dahong Zhigu Industrial Park, No. 59 Gangzai Street, Baoan District, Shenzhen,Guangdong Province
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